Master of Science (MSc) in Electronics and Communication Engineering (ECE)
*Program Overview*
*Objective*: Equip students with advanced knowledge in electronics, communication systems, signal processing, and embedded technologies.
*Credits*: 60–70 credits (varies by university), including labs, projects, and a thesis/dissertation.
*Year 1: Core Curriculum*
*Semester 1*
1. *ECE 501: Advanced Digital Signal Processing* (4 credits)
- Discrete-time signals, FFT, wavelet transforms, and applications in communication systems.
- Lab: MATLAB/Simulink simulations.
2. *ECE 502: Analog and Digital Communication Systems* (4 credits)
- Modulation techniques (AM, FM, QPSK), error control coding, and 5G fundamentals.
3. *ECE 503: VLSI Design* (4 credits)
- CMOS circuits, FPGA programming, and ASIC design using CAD tools (Cadence, Verilog).
- Lab: Layout design and simulation.
4. *ECE 504: Electromagnetic Theory & Antennas* (3 credits)
- Maxwell’s equations, microwave engineering, and antenna array design.
*Semester 2*
1. *ECE 505: Embedded Systems & IoT* (4 credits)
- Microcontrollers (ARM, Arduino), RTOS, and IoT protocols (MQTT, LoRaWAN).
- Lab: Sensor networks and edge computing.
2. *ECE 506: Optical Communication* (3 credits)
- Fiber optics, DWDM systems, and photonic devices.
3. *ECE 507: Wireless Communication* (4 credits)
- MIMO, OFDM, LTE/5G architecture, and RF circuit design.
4. *ECE 508: Control Systems* (3 credits)
- State-space analysis, PID controllers, and robotics applications.
*Year 2: Specializations & Thesis*
*Specializations* (Choose one track):
- *Communication Systems*: 6G networks, satellite communication, radar systems.
- *VLSI & Embedded Systems*: ASIC verification, low-power design, SoC.
- *Signal Processing & AI*: Machine learning for ECE, biomedical signal analysis.
- *RF & Microwave Engineering*: MMIC design, terahertz technologies.
*Electives* (Sample Options):
- ECE 601: Advanced MEMS and Sensors
- ECE 602: Quantum Communication
- ECE 603: Machine Learning for Signal Processing
- ECE 604: Nanoelectronics
- ECE 605: Cybersecurity in IoT
*Semester 3*
1. *Specialization Course 1* (4 credits)
2. *Specialization Course 2* (4 credits)
3. *ECE 700: Research Methodology* (2 credits)
- Technical writing, literature review, and thesis proposal.
*Semester 4*
1. *ECE 790: Thesis/Dissertation* (12 credits)
- Independent research under faculty guidance, with a focus on innovation in ECE.
- Examples: Design of a 5G transceiver, AI-based signal compression, IoT security frameworks.
*Labs & Practical Work*
- *Key Labs*:
- DSP Lab (MATLAB, Python)
- VLSI Lab (Cadence, Xilinx Vivado)
- RF & Microwave Lab (Network analyzers, ADS software)
- Embedded Systems Lab (Raspberry Pi, ARM Cortex-M)
- *Mini-Projects*:
- Semester 1–2: Design a frequency synthesizer, IoT-based health monitor.
- Semester 3: Implement a machine learning model for signal classification.
*Assessment & Grading*
- *Exams*: 60% (theory), 40% (practical/projects).
- *Grading*: A (90+), B (80–89), C (70–79); minimum 70% to pass.
- *Thesis Evaluation*: Oral defense and peer-reviewed publication (if applicable).
*Additional Requirements*
- *Internship*: Optional 6–8 weeks in industries like Qualcomm, Intel, or telecom firms.
- *Workshops*: Certifications in PCB design (Altium), Python for ECE, or 5G NR (via Coursera/edX).
- *Prerequisites*: Bachelor’s in ECE/EE with coursework in analogue/digital electronics.